Silicon Platform for IoT Applications
Platform consists of low-power communication interface, sensor interface, CPU/MCU, power management IP, low-power memory and standard cell library, package design and a FPGA prototype system for concurrent engineering. The subsystems can be individually optimized to support various IoT applications providing customization capability. Features include:
1. The silicon-validated, single-mode Bluetooth Low Energy (BLE) and dual-mode BLE subsystems include a fully integrated PHY and BB/MAC layer.
2. IoT applications, such as motion, voice, touch and vision.
3. Power management
4. Low-power logic and memory. Operating the chip at lowest possible supply (CV2) and clock frequency is the most straight forward power saving technique.